Backplanes

Backplane/Midplane Products

Up to 64 layers
• Max thickness .374” (9.5 mm)
• Oversize panel size 24X48” (612 x 1220mm)
• M-Tg, Hi-Tg, low Dk/Df materials
• Press fit holes
• Controlled impedance
• Backdrilling - Multiple depths, both sides
• Blind vias, Dual Vias, Air via
• Blind press-fit holes
• Cover PI-film on the surface
• Immersion Tin or OSP or ENIG
Reliability testing - Thermal stress, IST, T-260
Used as backbone of network switches/routers, servers and basestations