Line card Products
Line Cards Std - Adv
Up to 40 Layers
High density designs
• Max thickness 0.180”(4.5mm)
• Max panel size 24X42”(612X1070mm)
• Line/space to 3.0/3.0 mils (76um/76um, inner layers)
• Min core 1.0 mils (25.0um)
• Via in pad (POFV/VIPPO)
• 0.2mm drill size
• 0.5mm BGA
• Back drill registration D+6 
  Sequential Lamination
  1. N+N;
  2. N+N+N;
Processes available:
• LDI (Laser Directing Image)
• 8 camera post-etch punch
• CCD Back-drilling