HDI Products
• HDI = High Density Interconnect (Micro via)
• Layer count –up to 32 L
• Maximum thickness – 135mils (3.43mm)
• Max panel size 21X24” (535X612mm)
• Laser hole size: 4.9 ~ 14mil
    – Various structure types: 1+N+1, 2+N+2
    – Various via types: Staggered, Skip Vias 1-4, Stacked
• Via-in-pad designs
    – Epoxy filled
    – Via filling
    – Plated over filled via (POFV/VIPPO)
• Press fit Coin designs
• Conformal, large window, DLD Process
• Laser drillable Prepregs (LDP)
• Currently 14 Gauss +2 Top-hat CO2 laser drills
• Used in hi-speed line cards