Heat sinks (Metal-backed PCB)
• Production since 2003
• Hybrid or Teflon PCB’s
• Bonded to thick Copper pallets ( 1mm – 5mm)
• Large WPNL size
• Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs
• Coin assembly by Bonding film, PSA , Embedded coin & Press fit
• Special team to support NPI and production.
• Used in Power amplifiers or RF modules.