The annual conference for packaging, electro-mechanics and 3D printing
The annual conference for packaging, electro-mechanics, and 3D printing is scheduled for November 2023 at Expo Tel Aviv. Pavilion #10
Around 2,000 participants are estimated to take part in the conference, taking part in two lecture courses held alongside an impressive display of leading companies in the industry
ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS & 3D DAY
The annual Electronic Packaging, Electro–Mechanical Solutions & 3D Printing 2022 Conference and Trade Fair will deal with providing various solutions for electronic system packaging, will present innovations and solutions for connecting mother boards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial and military packaging, racks and cabins for communication applications and for special environmental conditions, packaging materials, fasteners, solutions for heat removal and cooling in racks and packages, industrial designing, content tools, simulation, analysis and environmental test innovations, machining of metal and plastic parts, standardization services and more. Senior lecturers from the industry and the academy, as well as guest lecturers from around the world, will take part in the conference giving lectures and presenting innovations in the packaging field, innovations in the material, coating and coloring fields, packaging solutions for special applications, production and speed modelling technologies, heat removal and cooling, electromagnetic compliance, RFI, EMC and EMI and more.
Comtel Israel will present its cutting-edge technologies and it's elite manufacturers, along with dozens of manufacturers, dealers, representatives, subcontractors, industrial designers, consultants, and suppliers of fasteners at the trade fair.
Admission to the conference and to the trade fair is free of charge; nevertheless, registration in advance is required
