plantek

Plantek Co., Ltd -Our engineering company specializes in development, design and production of electronic packaging equipment. Plantek is involved in projects from the initial stage of development through the production process, integration of the system and delivery of the finished product to the client.

Plantek specializes in a large number of planning and manufacturing technologies, which enables it to be well integrated in a large variety of projects that require a wide scope at system level, deep knowledge in realizing a product through the shortest, fastest and cheapest route, without taking unnecessary risks at the design and manufacturing level.

Plantek Co., Ltd. can suit itself to meet customer requirements, to supply fast and thorough solutions that enable quick decisions, and technical support that enables real-time decision making.In this case, the contribution to new fast projects and performing adjustments on standard products will leverage design and purchase, as well as the introduction of new customers into the system, and the persuasion of customers in a finished product. This will result in a significant growth in products customer base.

Plantek team is skilled and up-to-date on all new developments in the field of electronic packaging. High quality work and rapid execution make our company distinctive and ahead of others in the field.

Areas of Activity
Design of electronic packaging, from the S.O.W up to the prototype.
Design for both, military and civilian industries, based on their specifications.
Supervision and mechanical support in design up to final production and integration of the product.
Design in accordance with ergonomics, routine maintenance and product reliability.
Execution of thermal and liquid permeability analysis. EMI shielding and standardization.
Design in accordance with diverse production methods, such as: sheet metal, machining,
plastic injection molding, aluminum casting and aluminum extrusion.

Areas of Specialization
Design of keyboards and integration of lcd displays.
Electro-optic packaging: development of miniature CCD cameras.
Making civilian equipment for rugged military kits.
Development of panning unit and day/night vision systems.
Development of sustainable products in extreme field conditions and at a depth of 50 atm.
Solving overheating problems in electronic systems.
Reducing production costs in new and existing products.
Design of equipment for wireless and wire communications systems.
Development of 19” Racks and other accessories.